Nelson José de Oliveira Rodrigues


AuthID: R-00M-1H1

Confirmed Publications: 47



31
TITLE: A NUMERICAL STUDY OF SOLDER PASTE ROLLING PROCESS FOR PCB PRINTING
AUTHORS: Oliveira, RF; Rodrigues, N ; Teixeira, JC; Santos, D; Soares, D; Cerqueira, MF; S F C F Teixeira ;
PUBLISHED: 2019, SOURCE: ASMEInternational Mechanical Engineering Congress and Exposition (IMECE2018) in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2018, VOL 2, VOLUME: 2
INDEXED IN: Scopus WOS CrossRef Handle
IN MY: ORCID | CIÊNCIAVITAE
32
TITLE: Assessment of Indoor Thermal Conditions in a Cinema Room Using CFD Simulation: A Case Study
AUTHORS: Rodrigues, N ; Silva, J ; Teixeira, J; S F C F Teixeira ;
PUBLISHED: 2019, SOURCE: 19th International Conference on Computational Science and Its Applications, ICCSA 2019 in COMPUTATIONAL SCIENCE AND ITS APPLICATIONS - ICCSA 2019, PT VI, VOLUME: 11624
INDEXED IN: Scopus WOS CrossRef: 2
IN MY: ORCID | CIÊNCIAVITAE
33
TITLE: Simulation of PMV and PPD Thermal Comfort Using EnergyPlus
AUTHORS: Esteves, D; Silva, J ; Rodrigues, N ; Martins, L; Teixeira, J; S F C F Teixeira ;
PUBLISHED: 2019, SOURCE: 19th International Conference on Computational Science and Its Applications, ICCSA 2019 in COMPUTATIONAL SCIENCE AND ITS APPLICATIONS - ICCSA 2019, PT VI, VOLUME: 11624
INDEXED IN: Scopus WOS CrossRef: 7 Handle
IN MY: ORCID | CIÊNCIAVITAE
34
TITLE: Thermal comfort assessment of orthopaedic health professionals in an operating room
AUTHORS: Nelson Rodrigues ; Miguel, AS; S F C F Teixeira ; Constantino Fernandes; J. Santos Baptista ;
PUBLISHED: 2018, SOURCE: 6th International Symposium on Occupational Safety and Hygiene (SHO) in OCCUPATIONAL SAFETY AND HYGIENE VI
INDEXED IN: Scopus WOS CrossRef
IN MY: ORCID | CIÊNCIAVITAE
35
TITLE: CFD MODELING THE COOLING STAGE OF REFLOW SOLDERING PROCESS
AUTHORS: Ferreira, AC ; S F C F Teixeira ; Oliveira, RF; Rodrigues, NJ ; Teixeira, JCF; Soares, D;
PUBLISHED: 2017, SOURCE: ASME International Mechanical Engineering Congress and Exposition (IMECE2016) in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2016, VOL. 2, VOLUME: 2
INDEXED IN: Scopus WOS CrossRef: 2 Handle
IN MY: ORCID | CIÊNCIAVITAE
36
37
TITLE: Contact angle measurement of SAC 305 solder: numerical and experimental approach  Full Text
AUTHORS: Rodrigues, N ; Ferreira, AC ; S F C F Teixeira ; Soares, D; Teixeira, JC; Cerqueira, F; Macedo, F;
PUBLISHED: 2016, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 27, ISSUE: 9
INDEXED IN: Scopus WOS CrossRef: 8 Handle
IN MY: ORCID | CIÊNCIAVITAE
38
TITLE: Numerical simulation of an industrial worker route using thermal human body software
AUTHORS: Teixeira, J. Carlos; Teixeira, S. F. C. F.; Isabel F Loureiro; Nelson J O Rodrigues ; Nilton A Gomes;
PUBLISHED: 2016
INDEXED IN: Handle
IN MY: ORCID
39
TITLE: Evaluation of thermal comfort levels concerning the spatial arrangement in an operating room
AUTHORS: Rodrigues, N ; Fernandes, C; Miguel, A; S F C F Teixeira ; Leao, C; J. Santos Baptista ;
PUBLISHED: 2015, SOURCE: International Symposium on Occupational Safety and Hygiene (SHO) in SHO2015: INTERNATIONAL SYMPOSIUM ON OCCUPATIONAL SAFETY AND HYGIENE
INDEXED IN: WOS Handle
IN MY: ORCID | CIÊNCIAVITAE
40
TITLE: MODELING THE REFLOW SOLDERING PROCESS IN PCB'S
AUTHORS: Costa, J; Soares, D; S F C F Teixeira ; Cerqueira, F; Macedo, F; Rodrigues, N ; Ribas, L; Teixeira, JC;
PUBLISHED: 2015, SOURCE: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) in INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2, VOLUME: 2
INDEXED IN: Scopus WOS CrossRef: 2
IN MY: ORCID | CIÊNCIAVITAE
Page 4 of 5. Total results: 47.

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