Temperature Calibration for Distributed Temperature Sensing of Printed Circuit Boards Using Optical Fiber Sensors

AuthID
 P-00Z-DS4
7
Author(s)
Leite, TM
·
Freitas, C
·
Magalhaes, R
·
Alves, JR
·
Delgado, I
Document Type
Article
Year published
2023
Published
in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, ISSN: 2156-3950
Volume: 13, Issue: 9, Pages: 1380-1387 (8)
Indexing
Wos®
Scopus®
Crossref®1
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-85171561894
Wos: WOS:001098065500006
Source Identifiers
ISSN: 2156-3950
Export Publication Metadata
Marked List
 Add to Marked List
Info
At this moment we don't have any links to full text documens.

A place for researchers and their institutions

Useful Links

Get Help

© 2024 CRACS & Inesc TEC - All Rights Reserved Privacy Policy | Terms of Service