Development and Characterization of Bulk and Epoxy Molding Compounds from Non-Metallic Fractions Recovered from Printed Circuit Boards

AuthID
 P-011-SPB
6
Author(s)
Silva, M
·
Silva, R
·
Nóvoa, P
·
Soares, HMVM
·
Bastos, MMSM
·
Document Type
Proceedings Paper
Year published
2022
Published
in MATERIAIS 2022
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