Interfacial Reactions During Soldering with Lead-Tin Eutectic and Lead (Pb)-Free, Tin-Rich Solders

AuthID
 P-014-YY1
3
Author(s)
Kang, SK
·
Purushothaman, S
Document Type
Article
Year published
1996
Published
in JOURNAL OF ELECTRONIC MATERIALS, ISSN: 0361-5235
Volume: 25, Issue: 7, Pages: 1113-1120 (8)
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Publication Identifiers
Wos: WOS:A1996UW20700016
Source Identifiers
ISSN: 0361-5235
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