Effect of Local Hot Spots on the Maximum Dissipation Rates During Flow Boiling in a Microchannel

AuthID
 P-003-YV6
4
Author(s)
Revellin, R
·
Quiben, JM
·
Thome, JR
Document Type
Article
Year published
2008
Published
in IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, ISSN: 1521-3331
Volume: 31, Issue: 2, Pages: 407-416 (10)
Indexing
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Scopus®
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Publication Identifiers
Scopus: 2-s2.0-55849134063
Wos: WOS:000256584600020
Source Identifiers
ISSN: 1521-3331
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