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Characterization and Modeling of the Power Delivery Networks of Memory Chips
AuthID
P-005-6T9
11
Author(s)
Stievano, IS
·
Maio, IA
·
Rigazio, L
·
Canavero, FG
·
Izzi, R
·
Girardi, A
·
Lessio, T
·
Conci, A
·
Cunha, T
·
Teixeira, H
·
Pedro, JC
Document Type
Proceedings Paper
Year published
2009
Published
in
2009 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS
Pages: 5-8 (4)
Conference
13Th Ieee Workshop on Signal Propagation on Interconnects,
Date:
MAY 12-15, 2009,
Location:
Strasbourg, FRANCE,
Sponsors:
IEEE Comp Soc, IEEE Comp Soc TCCSP, IEEE Components Packaging & Mfg Technol Soc, CNRS, UBO
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®
Scopus
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Metadata
Sources
Publication Identifiers
DOI
:
10.1109/spi.2009.5089835
SCOPUS
: 2-s2.0-70349981887
Wos
: WOS:000273157400002
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