The Residual Stresses on Mechanical Properties of Copper Thin Films

AuthID
P-005-K3Y
3
Author(s)
Vieira, MT
2
Editor(s)
SilvaGomes, JF; Vaz, MAP
Document Type
Proceedings Paper
Year published
2012
Published
in ICEM15: 15TH INTERNATIONAL CONFERENCE ON EXPERIMENTAL MECHANICS
Conference
15Th International Conference on Experimental Mechanics (Icem), Date: JUL 22-27, 2012, Location: Porto, PORTUGAL, Sponsors: Portuguese Assoc Expt Mech (APAET), European Soc Expt Mech (EURASEM), Amer Soc Expt Mech (SEM), British Soc Strain Measurement (BSSM), Japanese Soc Mech Engn (JSME), Int Measurement Confederat (IMEKO), Assoc Francaise Mecanique (AFM), European Assoc Dynam Mat (DYMAT), Inst Engenharia Mecanica & Gestao Ind (INEGI), Lab Biomecanica Porto (LABIOMEP), Lab Nacl Engenharia Civil (LNEC), Fundacao Ciencia & Tecnologia (FCT), DYN CORK Tech Ind, Lda, Amorim Cork Composites, Comissao Coordenacao & Desenvolvimento Reg Norte (CCDRN), Camara Municipal Porto (CMP), Guimaraes, Teatro Nacl S Joao, ABREU PCO, Host: Univ Porto, Fac Engn (FEUP)
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Wos: WOS:000320722903006
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