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Processability and Electrical Characteristics of Glass Substrates for Rf Wafer-Level Chip-Scale Packages

AuthID
P-007-AVZ

Author(s)

Polyakov, A

Sinaga, SM

Document Type

Proceedings Paper

Year published

2003

Published

in 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS in ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ISSN: 0569-5503

Pages: 875-880 (6)

Conference

53Rd Electronic Components and Technology Conference, Date: MAY 27-30, 2003, Location: NEW ORLEANS, LA, Sponsors: IEEE, CPMT, Electr Components, Assemblies & Mat Assoc, Electr Ind Alliance

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Publication Identifiers

DOI: 10.1109/ectc.2003.1216394

SCOPUS: 2-s2.0-0038688978

Wos: WOS:000183448100146

Source Identifiers

ISSN: 0569-5503

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Processability and Electrical Characteristics of Glass Substrates for Rf Wafer-Level Chip-Scale Packages

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