Algorithms For Coupled Transient Simulation Of Circuits And Complicated 3-D Packaging

AuthID
 P-009-0J9
3
Author(s)
KAMON, M
·
WHITE, J
Document Type
Article
Year published
1995
Published
in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, ISSN: 1070-9894
Volume: 18, Issue: 1, Pages: 92-98 (7)
Conference
44Th Electronic Components and Technology Conference, Date: MAY 01-04, 1994, Location: WASHINGTON, DC, Sponsors: IEEE, Components Hybrids & Mfg Technol Soc, Electr Ind Assoc
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Publication Identifiers
SCOPUS: 2-s2.0-0029244870
Wos: WOS:A1995QH13100019
Source Identifiers
ISSN: 1070-9894
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