Efficient Frequency-Domain Modeling And Circuit Simulation Of Transmission-Lines

AuthID
 P-009-0JF
5
Author(s)
ELFADEL, IM
·
WHITE, JK
·
CHILUKURI, M
·
KUNDERT, KS
Document Type
Article
Year published
1994
Published
in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, ISSN: 1070-9894
Volume: 17, Issue: 4, Pages: 505-513 (9)
Conference
Ieee 2Nd Topical Meeting on the Electrical Performance of Electronic Packaging, Date: OCT, 1993, Location: MONTEREY, CA, Sponsors: IEEE, MICROWAVE THEORY & TECH SOC, IEEE, COMPONENTS PACKAGING & MFG TECHNOL SOC
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Publication Identifiers
SCOPUS: 2-s2.0-0028543304
Wos: WOS:A1994PY29200007
Source Identifiers
ISSN: 1070-9894
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