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Production of Low Cost Contacts and Joins for Large Area Devices by Electrodeposition of Cu and Sn

AuthID
P-000-Y66

Author(s)

Ferreira, J

Seiroco, H

Marvao, AP

Document Type

Article

Year published

2000

Published

in APPLIED SURFACE SCIENCE, ISSN: 0169-4332

Volume: 168, Issue: 1-4, Pages: 292-295 (4)

Conference

Spring Meeting of the European-Materials-Research-Society, Date: MAY 29-JUN 02, 2000, Location: STRASBOURG, FRANCE, Sponsors: European Mat Res Soc

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Metadata
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Publication Identifiers

DOI: 10.1016/s0169-4332(00)00627-9

SCOPUS: 2-s2.0-0034514366

Wos: WOS:000166184400068

Source Identifiers

ISSN: 0169-4332

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Production of Low Cost Contacts and Joins for Large Area Devices by Electrodeposition of Cu and Sn

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Production of Low Cost Contacts and Joins for Large Area Devices by Electrodeposition of Cu and Sn

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