Modeling The Reflow Soldering Process In Pcb's

AuthID
 P-00K-2WJ
8
Author(s)
Costa, J
·
Soares, D
·
Ribas, L
·
Document Type
Proceedings Paper
Year published
2015
Published
in INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2
Volume: 2
Conference
Asme International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (Interpack), Date: JUL 06-09, 2015, Location: San Francisco, CA, Sponsors: ASME
Indexing
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Scopus®
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Publication Identifiers
SCOPUS: 2-s2.0-84953923613
Wos: WOS:000373517300032
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