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On the Kinetics of Copper Electroless Plating with Hypophosphite Reductant
AuthID
P-00K-EH6
2
Author(s)
Martins, JI
·
Nunes, MC
Document Type
Article
Year published
2016
Published
in
SURFACE ENGINEERING,
ISSN: 0267-0844
Volume: 32, Issue: 5, Pages: 363-371 (9)
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Publication Identifiers
DOI
:
10.1179/1743294415y.0000000066
Scopus
: 2-s2.0-84964411270
Wos
: WOS:000374571500006
Source Identifiers
ISSN
: 0267-0844
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