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Low-Temperature Thermal Conductivity of Highly Porous Copper
AuthID
P-00M-0AR
4
Author(s)
Tomás, G
·
Martins, D
·
Cooper, A
·
Bonfait, G
Document Type
Article
Year published
2015
Published
in
IOP Conference Series: Materials Science and Engineering,
ISSN: 1757-8981
Volume: 101, Pages: 012004
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DOI
:
10.1088/1757-899x/101/1/012004
Unpaywall
: 10.1088/1757-899x/101/1/012004
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ISSN
: 1757-8981
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