Homogenization on Multi-Materials' Elements: Application to Printed Circuit Boards and Warpage Analysis

AuthID
P-00M-EQ0
4
Author(s)
Araujo, M
·
Silva, P
·
Delgado, P
3
Editor(s)
Saanouni,K;Chenot,JL;Duval,JL
Document Type
Proceedings Paper
Year published
2016
Published
in NUMIFORM 2016: THE 12TH INTERNATIONAL CONFERENCE ON NUMERICAL METHODS IN INDUSTRIAL FORMING PROCESSES in MATEC Web of Conferences, ISSN: 2261-236X
Volume: 80
Conference
12Th International Conference on Numerical Methods in Industrial Forming Processes (Numiform), Date: JUL 04-07, 2016, Location: Univ Technol Troyes, Troyes, FRANCE, Sponsors: ESI Grp, Transvalor SA, Reg Champagne Ardenne, Conseil Gen lAube, QForm, Grand Troyes, lAssoc Francaise Mecanique, MECAMAT, Mk2i, Composite Integr, Host: Univ Technol Troyes
Indexing
Publication Identifiers
Wos: WOS:000392331100104
Source Identifiers
ISSN: 2261-236X
Export Publication Metadata
Marked List
Info
At this moment we don't have any links to full text documens.