in PROCEEDINGS OF THE TWELFTH INTERNATIONAL CONFERENCE ON TANGIBLE, EMBEDDED, AND EMBODIED INTERACTION (TEI'18)
Volume: 2018-January, Pages: 260-265 (6)
Conference
12Th International Conference on Tangible, Embedded, and Embodied Interaction (Tei), Date: MAR 18-21, 2018, Location: KTH Royal Inst Technol, Stockholm, SWEDEN, Sponsors: Assoc Comp Machinery, ACM SIGCHI, Host: KTH Royal Inst Technol