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Low-Density Fan-Out Sip for Wearables and Iot with Heterogeneous Integration
AuthID
P-00Q-4YE
11
Author(s)
Martins, A
·
Pinheiro, M
·
Ferreira, AF
·
Almeida, R
·
Matos, F
·
Oliveira, J
·
O'Toole, E
·
Santos, HM
·
Monteiro, MC
·
Gamboa, H
·
Silva, RP
Document Type
Proceedings Paper
Year published
2018
Published
in
2018 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC)
Conference
International Wafer Level Packaging Conference (Iwlpc),
Date:
OCT 23-25, 2018,
Location:
San Jose, CA
Indexing
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®
Scopus
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®
Metadata
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Publication Identifiers
DOI
:
10.23919/iwlpc.2018.8573275
Scopus
: 2-s2.0-85060450899
Wos
: WOS:000462176800015
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