Influence Of The Microstructure On The Creep Behaviour Of Tin-Silver Copper Solder

AuthID
 P-00Q-J83
8
Author(s)
Ribeiro, PE
·
Soares, DF
·
Cerqueira, MF
·
Barros, DA
·
Teixelra, JC
·
Capela, P
·
Macedo, F
Document Type
Proceedings Paper
Year published
2019
Published
in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, 2018, VOL 12
Conference
Asmeinternational Mechanical Engineering Congress and Exposition (Imece2018), Date: NOV 09-15, 2018, Location: Pittsburgh, PA, Sponsors: Amer Soc Mech Engineers
Indexing
Wos®
Publication Identifiers
Wos: WOS:000465192900023
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