Blended Academic International Mobility: Tearing down Barriers to Mobility in a Sustainable Way

AuthID
 P-00T-TD1
6
Author(s)
Welzer, T
·
Papadourakis, G
3
Editor(s)
Cardoso,A;Alves,GR;Restivo,MT
Document Type
Proceedings Paper
Year published
2020
Published
in PROCEEDINGS OF THE 2020 IEEE GLOBAL ENGINEERING EDUCATION CONFERENCE (EDUCON 2020) in IEEE Global Engineering Education Conference, ISSN: 2165-9567
Pages: 1434-1443 (10)
Conference
Ieee Global Engineering Education Conference (Ieee Educon), Date: APR 27-30, 2020, Location: ELECTR NETWORK, Sponsors: IEEE, P Porto, U Porto, Univ Coimbra, IEEE Educ Soc, MathWorks, REN, Keysight Technologies, Schweitzer Engn Labs, Rohde & Schwarz, Comtrade, Continental, Symington
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Wos®
Publication Identifiers
Wos: WOS:000617739900216
Source Identifiers
ISSN: 2165-9567
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