Publications

Towards a Wireless System That Can Monitor the Encapsulation of Mm-Sized Active Implants in Vivo for Bioelectronic Medicine

AuthID
P-00V-1V6

Author(s)

Rodrigues, G

Neca, M

Silva, J

Brito, D

Rabuske, T

Fernandes, J

Mohrlok, R

Jeschke, C

Meents, J

Nanbakhsh, K

Giagka, V

Document Type

Proceedings Paper

Year published

2021

Published

in 2021 10TH INTERNATIONAL IEEE/EMBS CONFERENCE ON NEURAL ENGINEERING (NER) in International IEEE EMBS Conference on Neural Engineering, ISSN: 1948-3546

Volume: 2021-May, Pages: 981-984 (4)

Conference

10Th International Ieee-Embs Conference on Neural Engineering (Ner), Date: MAY 04-06, 2021, Location: Prague, ELECTR NETWORK, Sponsors: Medtronic, Blackrock Microsystems, IEEE Engn Med & Biol Soc, Inst Italiano Tecnologia, Biorobot Inst, Sant Anna Sch Adv Studies, Univ Houston, Cullen Coll Engn, Dept Biomed Engn, Wearable Robot, Frontiers Neuroscience, EPFL, Elsevier, CorTec, Abbott, Univ Pittsburgh, IEEE Transact Neural Syst & Rehabilitat Engn, IEEE Open Journal Engn Med & Biol

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