Numerical Modeling of the Wave Soldering Process and Experimental Validation

AuthID
 P-00W-DX9
7
Author(s)
Arcipreste, B
·
Ribas, L
·
Document Type
Article
Year published
2022
Published
in JOURNAL OF ELECTRONIC PACKAGING, ISSN: 1043-7398
Volume: 144, Issue: 1
Indexing
Wos®
Scopus®
Crossref®6
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-85107811117
Wos: WOS:000774195200012
Source Identifiers
ISSN: 1043-7398
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