A New Copper Hybrid Compound Based on 3,3?-Diaminodiphenylsulfone as Ligand: Growth, Crystal Structure, Spectroscopic Analysis, and Thermal Behavior

AuthID
 P-00X-CXT
6
Author(s)
Ltaief, H
·
Ben Ali, S
·
Mahroug, A
·
Ferretti, V
·
Belhouchet, M
Document Type
Article
Year published
2023
Published
in JOURNAL OF MOLECULAR STRUCTURE, ISSN: 0022-2860
Volume: 1273, Pages: 134334 (12)
Indexing
Wos®
Scopus®
Crossref®2
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-85140241771
Wos: WOS:000904666500009
Source Identifiers
ISSN: 0022-2860
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