New Adhesion Process Based on Lead-Free Solder Applied in Electronic Power Devices

AuthID
 P-000-QP0
8
Author(s)
Seiroco, H
·
Vincente, M
·
Marvao, AP
·
1
Editor(s)
Vieira,T
Document Type
Article
Year published
2002
Published
in ADVANCED MATERIALS FORUM I in KEY ENGINEERING MATERIALS, ISSN: 1013-9826
Volume: 230-2, Pages: 92-95 (4)
Conference
1St International Materials Symposium (Materials 2001), Date: APR 09-11, 2001, Location: COIMBRA, PORTUGAL, Sponsors: Portuguese Soc Mat, Host: UNIV COIMBRA
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Publication Identifiers
SCOPUS: 2-s2.0-17544404371
Wos: WOS:000179553200020
Source Identifiers
ISSN: 1013-9826
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