Electrode Roughness and Interfacial Mixing Effects on the Tunnel Junction Thermal Stability

AuthID
P-000-VC2
6
Author(s)
Zhang, ZG
·
Wei, P
·
1
Editor(s)
Ching W.Y.Fidler J.Folks L.Katine J.A.
Document Type
Article
Year published
2001
Published
in JOURNAL OF APPLIED PHYSICS, ISSN: 0021-8979
Volume: 89, Issue: 11, Pages: 6650-6652 (3)
Conference
8Th Joint Mmm/Intermag Conference, Date: JAN 08-11, 2001, Location: SAN ANTONIO, TEXAS, Sponsors: Motorola Labs, TDK Corp, IBM, Toda Kogyo Corp, EMTEC Magnet GmbH, Quantum, Seagate Res, Sony Corp, Magnequench Technol Ctr, AJA Int Inc, Digital Measurement Syst
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-0035356053
Wos: WOS:000169151700023
Source Identifiers
ISSN: 0021-8979
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