Wafer-Level Integration of On-Chip Antennas and Re Passives Using High-Resistivity Polysilicon Substrate Technology

AuthID
 P-007-C2X
6
Author(s)
Sinaga, S
·
Polyakov, A
·
Bartek, M
·
Burghartz, JN
·
Document Type
Proceedings Paper
Year published
2004
Published
in 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS in Electronic Components and Technology Conference, ISSN: 0569-5503
Volume: 2, Pages: 1879-1884 (6)
Conference
54Th Electronic Components and Technology Conference, Date: FEB 03, 2004, Location: Las Vegas, NV, Sponsors: Elect Components Assembilies & Mat Assoc, Elect Ind Alliance, IEEE Comp Packaging & Mfg Technol Soc
Indexing
Wos®
Scopus®
Publication Identifiers
Scopus: 2-s2.0-10444283439
Wos: WOS:000224340900298
Source Identifiers
ISSN: 0569-5503
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