New Approach for Assessment of Dielectric Layer Adhesion Strength, Demonstrated on Ewlb Fo-Wlp Interfaces

AuthID
 P-009-415
5
Author(s)
Teixeira, J
·
Janeiro, A
·
Ribeiro, M
Document Type
Proceedings Paper
Year published
2013
Published
in 2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC) in European Microelectronics Packaging Conference, ISSN: 2165-2341
Conference
19Th European Microelectronics Packaging Conference (Empc), Date: SEP 09-12, 2013, Location: Grenoble, FRANCE, Sponsors: iNEMI, ST, Heraeus, AEPI, ASE Grp, Sencio, Yole Dev, Micronews
Indexing
Wos®
Scopus®
Publication Identifiers
SCOPUS: 2-s2.0-84893315831
Wos: WOS:000330675900002
Source Identifiers
ISSN: 2165-2341
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