Cu3Teo6Dielectric Thick Films: Processing by Electrophoretic Deposition and Electrical Characterization

AuthID
 P-00G-QW3
3
Author(s)
Zhu, X
·
1
Editor(s)
Boccaccini A.R.Van der Biest O.Uchikoshi T.Dickerson J.H.Ferrari B.
Document Type
Proceedings Paper
Year published
2015
Published
in Key Engineering Materials, ISSN: 1013-9826
Volume: 654, Pages: 114-121
Conference
5Th International Conference on Electrophoretic Deposition: Fundamentals and Applications, Epd 2014, Date: 5 October 2014 through 10 October 2014, Sponsors: Engineering Conferences International (ECI)
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Publication Identifiers
Scopus: 2-s2.0-84944322619
Source Identifiers
ISSN: 1013-9826
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