Development of a New 3D Openfoam (R) Solver to Model the Cooling Stage in Profile Extrusion

AuthID
P-00K-GDW
5
Author(s)
1
Editor(s)
Rhee,B
Document Type
Proceedings Paper
Year published
2016
Published
in PROCEEDINGS OF PPS-31: THE 31ST INTERNATIONAL CONFERENCE OF THE POLYMER PROCESSING SOCIETY in AIP Conference Proceedings, ISSN: 0094-243X
Volume: 1713
Conference
31St International Conference of the Polymer-Processing-Society (Pps), Date: JUN 07-11, 2015, Location: SOUTH KOREA, Sponsors: Polymer Proc Soc, LG Hausys, LG Chem, Lotte Chem, Hanwha Adv Mat Inc, Toray Adv Mat Korea Inc, KITECH KOAMI, New Opt Ltd, Kumho Petrochem, Kolon Ind, CoreTech Syst Co Ltd, RheoComp MKE, NPM Korea Co Ltd, NEW CENTURY TRADING Co Ltd, TA Instruments, LEADINGTECH, U Tec, Hyosung R&DB Labs, BL Tech, Natl Creat Res Initiat Ctr Smart Block Copolymers, Seoul Natl Univ, Ctr Nano Structured Polymer Proc Technol, Kyung Hee Univ, Funct Crystallizat Ctr
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Publication Identifiers
SCOPUS: 2-s2.0-84984568828
Wos: WOS:000375945000004
Source Identifiers
ISSN: 0094-243X
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