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A Compact 130Ghz Fully Packaged Point-To-Point Wireless System with 3D-Printed 26Dbi Lens Antenna Achieving 12.5Gb/S at 1.55Pj/B/M

AuthID
P-00M-KW5

Author(s)

Dolatsha, N

Grave, B

Sawaby, M

Chen, C

Babveyh, A

Kananian, S

Bisognin, A

Luxey, C

Gianesello, F

Costa, J

Fernandes, C

Arbabian, A

Editor(s)

Fujino,LC

Document Type

Proceedings Paper

Year published

2017

Published

in 2017 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC) in IEEE International Solid State Circuits Conference, ISSN: 0193-6530

Volume: 60, Pages: 306-306 (1)

Conference

64Th Ieee International Solid-State Circuits Conference (Isscc), Date: FEB 05-09, 2017, Location: San Francisco, CA, Sponsors: IEEE, Univ Penn, Inst Elect & Elect Engineers

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Publication Identifiers

DOI: 10.1109/isscc.2017.7870383

Handle: https://hdl.handle.net/10071/22880

Scopus: 2-s2.0-85016267140

Wos: WOS:000403393800127

Source Identifiers

ISSN: 0193-6530

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A Compact 130Ghz Fully Packaged Point-To-Point Wireless System with 3D-Printed 26Dbi Lens Antenna Achieving 12.5Gb/S at 1.55Pj/B/M

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A Compact 130Ghz Fully Packaged Point-To-Point Wireless System with 3D-Printed 26Dbi Lens Antenna Achieving 12.5Gb/S at 1.55Pj/B/M

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