Back Side Die Preparation for Check of Backend Related Problems

AuthID
 P-00P-3PY
7
Author(s)
Huettinger, M
·
Touzel, J
·
Janeiro, A
·
Guedes, R
·
Caldeira, C
·
Ribeiro, C
Document Type
Proceedings Paper
Year published
2006
Published
in ISTFA 2006
Pages: 356-+ (2)
Conference
32Nd International Symposium for Testing and Failure Analysis, Date: NOV 12-16, 2006, Location: Austin, TX, Sponsors: Elect Device Failure Anal Soc, ASM Int
Indexing
Wos®
Publication Identifiers
Wos: WOS:000282447800071
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