Publications

Two-Phase Thermosiphon Cooling Using Integrated Heat Spreaders with Copper Microstructures

AuthID
P-00P-E63

Author(s)

Abreu, V

Harrison, M

Gess, J

Moita, AS

Document Type

Proceedings Paper

Year published

2018

Published

in Proceedings of the 17th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2018

Pages: 645-652

Conference

17Th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Itherm 2018, Date: 29 May 2018 through 1 June 2018, Sponsors: A.James Clark School of Engineering;Calce;et al.;Intel;Smart and Small Thermal Systems Laboratory (S2TS);University of Maryland

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