in TEI'19: PROCEEDINGS OF THE THIRTEENTH INTERNATIONAL CONFERENCE ON TANGIBLE, EMBEDDED, AND EMBODIED INTERACTION
Pages: 307-313 (7)
Conference
13Th International Conference on Tangible, Embedded, and Embodied Interaction (Acm Tei), Date: MAR 17-20, 2019, Location: Tempe, AZ, Sponsors: Assoc Comp Machinery, ACM SIGCHI