Application of 3D Electronic Speckle Pattern Interferometry for the Analysis of Thermal Response in Printed Circuit Boards

AuthID
 P-00R-92N
7
Author(s)
Sousa, PJ
·
Carneiro, F
·
2
Editor(s)
Moreira,PMGP;Tavares,PJS
Document Type
Proceedings Paper
Year published
2019
Published
in 3RD INTERNATIONAL CONFERENCE ON STRUCTURAL INTEGRITY (ICSI 2019) in Procedia Structural Integrity, ISSN: 2452-3216
Volume: 17, Pages: 835-842 (8)
Conference
3Rd International Conference on Structural Integrity (Icsi), Date: SEP 02-05, 2019, Location: Funchal, PORTUGAL
Indexing
Wos®
Scopus®
Crossref®3
Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-85074662233
Wos: WOS:000505162900110
Source Identifiers
ISSN: 2452-3216
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