Hybrid Rigid-Flexible Magnetoresistive Device Based on a Wafer Level Packaging Technology for Micrometric Proximity Measurements

AuthID
 P-00R-KP0
5
Author(s)
Franco, F
·
Dias, RA
·
Gaspar, J
·
Document Type
Article
Year published
2019
Published
in IEEE SENSORS JOURNAL, ISSN: 1530-437X
Volume: 19, Issue: 24, Pages: 12363-12368 (6)
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Publication Identifiers
SCOPUS: 2-s2.0-85076379252
Wos: WOS:000506895500075
Source Identifiers
ISSN: 1530-437X
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