Experimental Evaluation and Simulation Validation of an Air-Cooled Loop Thermosyphon Designed for High Heat Load Cpus

AuthID
 P-00V-H4Y
5
Author(s)
Armas, G
·
Thome, JR
·
Zhang, LW
Document Type
Proceedings Paper
Year published
2021
Published
in PROCEEDINGS OF THE TWENTIETH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2021) in InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ISSN: 1936-3958
Volume: 2021-June, Pages: 65-73 (9)
Conference
20Th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm), Date: JUN 01-04, 2021, Location: ELECTR NETWORK, Sponsors: IEEE, IEEE Elect Packaging Soc, GE
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Publication Identifiers
Scopus: 2-s2.0-85125337288
Wos: WOS:000703033800009
Source Identifiers
ISSN: 1936-3958
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