Air-Cooled Loop Thermosyphon Cooling System for High Heat Load Cpus-Part I: Design and Performance Simulation

AuthID
P-00V-NJ8
5
Author(s)
Armas, GSRB
·
Thome, JR
·
Zhang, LW
Document Type
Article
Year published
2021
Published
in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, ISSN: 2156-3950
Volume: 11, Issue: 10, Pages: 1679-1686 (8)
Indexing
Publication Identifiers
Wos: WOS:000712564200018
Source Identifiers
ISSN: 2156-3950
Export Publication Metadata
Marked List
Info
At this moment we don't have any links to full text documens.