Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects

AuthID
 P-00W-31M
5
Author(s)
Oliveira, BMC
·
Savaris, LCG
·
Ferreira, PJ
·
Document Type
Article
Year published
2022
Published
in INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES, ISSN: 1661-6596
Volume: 23, Issue: 3, Pages: 1891 (15)
Indexing
Wos®
Scopus®
Crossref®2
Pubmed®
Google Scholar®
Publication Identifiers
Pubmed: 35163817
Scopus: 2-s2.0-85124127688
Wos: WOS:000760090800001
Source Identifiers
ISSN: 1661-6596
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