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Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder
AuthID
P-00Y-YD7
8
Author(s)
Ribeiro P.E.
·
Barros D.A.
·
Soares D.F.
·
Teixeira J.C.
·
Cerqueira M.F.
·
Capela P.
·
Teixeira S.F.
·
Macedo F.
Document Type
Proceedings Paper
Year published
2018
Published
in
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume: 12
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Publication Identifiers
DOI
:
10.1115/imece2018-87789
Handle
:
https://hdl.handle.net/1822/71714
Scopus
: 2-s2.0-85060372892
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