Development of High Conductivity Lead (Pb) Free Conducting Adhesives

AuthID
 P-014-YY8
3
Author(s)
Kang, SK
·
Purushothaman, S
Document Type
Article
Year published
1998
Published
in IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, ISSN: 1070-9886
Volume: 21, Issue: 1, Pages: 18-22 (5)
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Publication Identifiers
Wos: WOS:000073622600004
Source Identifiers
ISSN: 1070-9886
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