D. Teomin
AuthID: R-007-44M
1
TITLE: Wafer-level chip-scale packaging for low-end RF products
AUTHORS: Bartek, M; Zilber, G; Teomin, D; Polyakov, A; Sinaga, S; Mendes, PM ; Burghartz, JN;
PUBLISHED: 2004, SOURCE: 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers in 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers
AUTHORS: Bartek, M; Zilber, G; Teomin, D; Polyakov, A; Sinaga, S; Mendes, PM ; Burghartz, JN;
PUBLISHED: 2004, SOURCE: 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers in 2004 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems: Digest of Papers
INDEXED IN: 
Scopus
Scopus