Francisco Jose Machado de Macedo
AuthID: R-000-5C3
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TITLE: INFLUENCE OF THE APPLIED LOAD ON THE CREEP BEHAVIOUR OF TIN-SILVER-COPPER SOLDER
AUTHORS: Soares, DF; Ribeiro, PE; Capela, P; Barros, DA; Cerqueira, MF; S F C F Teixeira ; Macedo, F; Teixeira, JC;
PUBLISHED: 2020, SOURCE: ASME International Mechanical Engineering Congress and Exposition (IMECE) in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2019, VOL 12: ADVANCED MATERIALS: DESIGN, PROCESSING, CHARACTERIZATION, AND APPLICATIONS, VOLUME: 12
AUTHORS: Soares, DF; Ribeiro, PE; Capela, P; Barros, DA; Cerqueira, MF; S F C F Teixeira ; Macedo, F; Teixeira, JC;
PUBLISHED: 2020, SOURCE: ASME International Mechanical Engineering Congress and Exposition (IMECE) in PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION - 2019, VOL 12: ADVANCED MATERIALS: DESIGN, PROCESSING, CHARACTERIZATION, AND APPLICATIONS, VOLUME: 12
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TITLE: Dataset for additional information on the evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr–O–N thin films
AUTHORS: da Silva Oliveira, CI; Martinez Martinez, D; Couto, FM; Cunha, L; Macedo, F;
PUBLISHED: 2020, SOURCE: Data in Brief, VOLUME: 29
AUTHORS: da Silva Oliveira, CI; Martinez Martinez, D; Couto, FM; Cunha, L; Macedo, F;
PUBLISHED: 2020, SOURCE: Data in Brief, VOLUME: 29
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TITLE: Fabrication, Characterization and Implementation of Thermo Resistive TiCu(N,O) Thin Films in a Polymer Injection Mold Full Text
AUTHORS: Oliveira, E; Silva, JP; Laranjeira, J; Macedo, F; Lanceros Mendez, S; Vaz, F; Ferreira, A;
PUBLISHED: 2020, SOURCE: MATERIALS, VOLUME: 13, ISSUE: 6
AUTHORS: Oliveira, E; Silva, JP; Laranjeira, J; Macedo, F; Lanceros Mendez, S; Vaz, F; Ferreira, A;
PUBLISHED: 2020, SOURCE: MATERIALS, VOLUME: 13, ISSUE: 6
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TITLE: Evaluation of thermal properties of thin films by IR radiometry using a comprehensive set of Zr-O-N thin films Full Text
AUTHORS: da Silva Oliveira, CI; Martinez Martinez, D; Couto, FM; Cunha, L; Macedo, F;
PUBLISHED: 2019, SOURCE: 25th Congress of International-Federation-for-Heat-Treatment-and-Surface-Engineering (IFHTSE) in APPLIED SURFACE SCIENCE, VOLUME: 498
AUTHORS: da Silva Oliveira, CI; Martinez Martinez, D; Couto, FM; Cunha, L; Macedo, F;
PUBLISHED: 2019, SOURCE: 25th Congress of International-Federation-for-Heat-Treatment-and-Surface-Engineering (IFHTSE) in APPLIED SURFACE SCIENCE, VOLUME: 498
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TITLE: Effect of the Soldering Atmosphere on the Wettability Between Sn4.0Ag0.5Cu (in wt.%) Lead-Free Solder Paste and Various Substrates Full Text
AUTHORS: Soares, D; Leitao, H; Lau, CS; Teixeira, JC; Ribas, L; Alves, R; S F C F Teixeira ; Cerqueira, MF; Macedo, F;
PUBLISHED: 2018, SOURCE: European Congress and Exhibition on Advanced Materials and Processes (Euromat) in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, VOLUME: 27, ISSUE: 10
AUTHORS: Soares, D; Leitao, H; Lau, CS; Teixeira, JC; Ribas, L; Alves, R; S F C F Teixeira ; Cerqueira, MF; Macedo, F;
PUBLISHED: 2018, SOURCE: European Congress and Exhibition on Advanced Materials and Processes (Euromat) in JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE, VOLUME: 27, ISSUE: 10
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TITLE: Influence of the microstructure on the creep behaviour of tin-silver-copper solder
AUTHORS: Pedro E Ribeiro; Daniel A Barros; Delfim F Soares; José C Teixeira; Maria F Cerqueira; Pauline Capela; S F C F Teixeira ; Francisco Macedo;
PUBLISHED: 2018, SOURCE: ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), VOLUME: 12
AUTHORS: Pedro E Ribeiro; Daniel A Barros; Delfim F Soares; José C Teixeira; Maria F Cerqueira; Pauline Capela; S F C F Teixeira ; Francisco Macedo;
PUBLISHED: 2018, SOURCE: ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), VOLUME: 12
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TITLE: Contact angle measurement of SAC 305 solder: numerical and experimental approach Full Text
AUTHORS: Rodrigues, N ; Ferreira, AC ; S F C F Teixeira ; Soares, D; Teixeira, JC; Cerqueira, F; Macedo, F;
PUBLISHED: 2016, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 27, ISSUE: 9
AUTHORS: Rodrigues, N ; Ferreira, AC ; S F C F Teixeira ; Soares, D; Teixeira, JC; Cerqueira, F; Macedo, F;
PUBLISHED: 2016, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 27, ISSUE: 9
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TITLE: Influence of Copper Layer Content in the Elastic and Damping Behavior of Glass-Fiber/Epoxy-Resin Composites Full Text
AUTHORS: Carneiro, VH; Capela, P; Teixeira, JC; S F C F Teixeira ; Cerqueira, F; Macedo, F; Ribas, L; Soares, D;
PUBLISHED: 2016, SOURCE: APPLIED COMPOSITE MATERIALS, VOLUME: 23, ISSUE: 6
AUTHORS: Carneiro, VH; Capela, P; Teixeira, JC; S F C F Teixeira ; Cerqueira, F; Macedo, F; Ribas, L; Soares, D;
PUBLISHED: 2016, SOURCE: APPLIED COMPOSITE MATERIALS, VOLUME: 23, ISSUE: 6
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TITLE: Evolution of the functional properties of titanium-silver thin films for biomedical applications: Influence of in-vacuum annealing Full Text
AUTHORS: Lopes, C; Goncalves, C; Borges, J; Polcar, T; Rodrigues, MS; Barradas, NP; Alves, E; Le Bourhis, E; Couto, FM; Macedo, F; Fonseca, C ; Vaz, F;
PUBLISHED: 2015, SOURCE: SURFACE & COATINGS TECHNOLOGY, VOLUME: 261
AUTHORS: Lopes, C; Goncalves, C; Borges, J; Polcar, T; Rodrigues, MS; Barradas, NP; Alves, E; Le Bourhis, E; Couto, FM; Macedo, F; Fonseca, C ; Vaz, F;
PUBLISHED: 2015, SOURCE: SURFACE & COATINGS TECHNOLOGY, VOLUME: 261
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TITLE: Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere Full Text
AUTHORS: Goncalves, C; Leitao, H; Lau, CS; Teixeira, JC; Ribas, L; S F C F Teixeira ; Cerqueira, MF; Macedo, F; Soares, D;
PUBLISHED: 2015, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 26, ISSUE: 7
AUTHORS: Goncalves, C; Leitao, H; Lau, CS; Teixeira, JC; Ribas, L; S F C F Teixeira ; Cerqueira, MF; Macedo, F; Soares, D;
PUBLISHED: 2015, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 26, ISSUE: 7
