Jose Inacio F. Paiva Martins
AuthID: R-00H-2GQ
1
TITLE: New adhesion process based on lead-free solder applied in electronic power devices
AUTHORS: Seiroco, H; Vincente, M; Ferreira, J; Fernandes, FB ; Marvao, AP; Martins, JI ; Fortunato, E ; Martins, R ;
PUBLISHED: 2002, SOURCE: 1st International Materials Symposium (Materials 2001) in ADVANCED MATERIALS FORUM I, VOLUME: 230-2
AUTHORS: Seiroco, H; Vincente, M; Ferreira, J; Fernandes, FB ; Marvao, AP; Martins, JI ; Fortunato, E ; Martins, R ;
PUBLISHED: 2002, SOURCE: 1st International Materials Symposium (Materials 2001) in ADVANCED MATERIALS FORUM I, VOLUME: 230-2
