José Carlos Fernandes Teixeira
AuthID: R-000-86F
131
TITLE: A Form-Closed Cam-Follower Mechanism for a Breath Simulator Machine
AUTHORS: Oliveira, RF; Flores, P; S F C F Teixeira ; Marques, HMC; Teixeira, JC;
PUBLISHED: 2015, SOURCE: 5th European Conference on Mechanism Science (EUCOMES) in NEW TRENDS IN MECHANISM AND MACHINE SCIENCE: FROM FUNDAMENTALS TO INDUSTRIAL APPLICATIONS, VOLUME: 24
AUTHORS: Oliveira, RF; Flores, P; S F C F Teixeira ; Marques, HMC; Teixeira, JC;
PUBLISHED: 2015, SOURCE: 5th European Conference on Mechanism Science (EUCOMES) in NEW TRENDS IN MECHANISM AND MACHINE SCIENCE: FROM FUNDAMENTALS TO INDUSTRIAL APPLICATIONS, VOLUME: 24
132
TITLE: Wetting behaviour of SAC305 solder on different substrates in high vacuum and inert atmosphere Full Text
AUTHORS: Goncalves, C; Leitao, H; Lau, CS; Teixeira, JC; Ribas, L; S F C F Teixeira ; Cerqueira, MF; Macedo, F; Soares, D;
PUBLISHED: 2015, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 26, ISSUE: 7
AUTHORS: Goncalves, C; Leitao, H; Lau, CS; Teixeira, JC; Ribas, L; S F C F Teixeira ; Cerqueira, MF; Macedo, F; Soares, D;
PUBLISHED: 2015, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 26, ISSUE: 7
133
TITLE: MODELLING THE AIR-FUEL MIXTURE IN AN ATMOSPHERIC BURNER
AUTHORS: Sa, AC; S F C F Teixeira ; Teixeira, JC;
PUBLISHED: 2015, SOURCE: 1st Pan-American Congress on Computational Mechanics (PANACM) / XI Argentine Congress on Computational Mechanics (MECOM) in PROCEEDINGS OF THE 1ST PAN-AMERICAN CONGRESS ON COMPUTATIONAL MECHANICS AND XI ARGENTINE CONGRESS ON COMPUTATIONAL MECHANICS
AUTHORS: Sa, AC; S F C F Teixeira ; Teixeira, JC;
PUBLISHED: 2015, SOURCE: 1st Pan-American Congress on Computational Mechanics (PANACM) / XI Argentine Congress on Computational Mechanics (MECOM) in PROCEEDINGS OF THE 1ST PAN-AMERICAN CONGRESS ON COMPUTATIONAL MECHANICS AND XI ARGENTINE CONGRESS ON COMPUTATIONAL MECHANICS
INDEXED IN: Scopus WOS
IN MY: ORCID
134
TITLE: THERMAL-ECONOMIC DESIGN OF A MICRO-GAS TURBINE CHP SYSTEM USING A MULTI-OBJECTIVE OPTIMIZATION APPROACH
AUTHORS: Ana C Ferreira ; Ismael I F Vaz; S F C F Teixeira ; Jose C Teixeira;
PUBLISHED: 2015, SOURCE: 1st Pan-American Congress on Computational Mechanics (PANACM) / XI Argentine Congress on Computational Mechanics (MECOM) in PROCEEDINGS OF THE 1ST PAN-AMERICAN CONGRESS ON COMPUTATIONAL MECHANICS AND XI ARGENTINE CONGRESS ON COMPUTATIONAL MECHANICS
AUTHORS: Ana C Ferreira ; Ismael I F Vaz; S F C F Teixeira ; Jose C Teixeira;
PUBLISHED: 2015, SOURCE: 1st Pan-American Congress on Computational Mechanics (PANACM) / XI Argentine Congress on Computational Mechanics (MECOM) in PROCEEDINGS OF THE 1ST PAN-AMERICAN CONGRESS ON COMPUTATIONAL MECHANICS AND XI ARGENTINE CONGRESS ON COMPUTATIONAL MECHANICS
INDEXED IN: Scopus WOS
IN MY: ORCID
135
TITLE: Thermal comfort assessment of a surgical room through computational fluid dynamics using local PMV index
AUTHORS: Nelson J O Rodrigues ; Ricardo F Oliveira; S F C F Teixeira ; Alberto Sergio Miguel ; Jose Carlos Teixeira; J. Santos Baptista ;
PUBLISHED: 2015, SOURCE: WORK-A JOURNAL OF PREVENTION ASSESSMENT & REHABILITATION, VOLUME: 51, ISSUE: 3
AUTHORS: Nelson J O Rodrigues ; Ricardo F Oliveira; S F C F Teixeira ; Alberto Sergio Miguel ; Jose Carlos Teixeira; J. Santos Baptista ;
PUBLISHED: 2015, SOURCE: WORK-A JOURNAL OF PREVENTION ASSESSMENT & REHABILITATION, VOLUME: 51, ISSUE: 3
136
TITLE: Abstracts: Drug Delivery to the Lungs 25 Abstracts
AUTHORS: Oliveira, RF; Silva, MV; S F C F Teixeira ; Cabral Marques, HM; Teixeira, JCF;
PUBLISHED: 2015, SOURCE: JOURNAL OF AEROSOL MEDICINE AND PULMONARY DRUG DELIVERY, VOLUME: 28, ISSUE: 4
AUTHORS: Oliveira, RF; Silva, MV; S F C F Teixeira ; Cabral Marques, HM; Teixeira, JCF;
PUBLISHED: 2015, SOURCE: JOURNAL OF AEROSOL MEDICINE AND PULMONARY DRUG DELIVERY, VOLUME: 28, ISSUE: 4
INDEXED IN: WOS
137
TITLE: Adapting Biped Locomotion to Sloped Environments Full Text
AUTHORS: Andre, J; Teixeira, C; Santos, CP; Costa, L;
PUBLISHED: 2015, SOURCE: JOURNAL OF INTELLIGENT & ROBOTIC SYSTEMS, VOLUME: 80, ISSUE: 3-4
AUTHORS: Andre, J; Teixeira, C; Santos, CP; Costa, L;
PUBLISHED: 2015, SOURCE: JOURNAL OF INTELLIGENT & ROBOTIC SYSTEMS, VOLUME: 80, ISSUE: 3-4
INDEXED IN: WOS Handle
138
TITLE: Quality requirements for the biomass in the SUDOE region
AUTHORS: Ferreira, J; Teixeira, JCF; Ferreira, MEC; Araújo, J;
PUBLISHED: 2015, SOURCE: 3rd International Conference on Wastes: Solutions, Treatments and Opportunities, Wastes 2015 in Wastes: Solutions, Treatments and Opportunities - Selected Papers from the 3rd Edition of the International Conference on Wastes: Solutions, Treatments and Opportunities, 2015
AUTHORS: Ferreira, J; Teixeira, JCF; Ferreira, MEC; Araújo, J;
PUBLISHED: 2015, SOURCE: 3rd International Conference on Wastes: Solutions, Treatments and Opportunities, Wastes 2015 in Wastes: Solutions, Treatments and Opportunities - Selected Papers from the 3rd Edition of the International Conference on Wastes: Solutions, Treatments and Opportunities, 2015
INDEXED IN: Scopus
IN MY: ORCID
139
TITLE: Torrefaction effects on composition and quality of biomass wastes pellets
AUTHORS: Nobre, C; Gonçalves, M; Mendes, B; Vilarinho, C; Teixeira, J;
PUBLISHED: 2015, SOURCE: 3rd International Conference on Wastes: Solutions, Treatments and Opportunities, Wastes 2015 in Wastes: Solutions, Treatments and Opportunities - Selected Papers from the 3rd Edition of the International Conference on Wastes: Solutions, Treatments and Opportunities, 2015
AUTHORS: Nobre, C; Gonçalves, M; Mendes, B; Vilarinho, C; Teixeira, J;
PUBLISHED: 2015, SOURCE: 3rd International Conference on Wastes: Solutions, Treatments and Opportunities, Wastes 2015 in Wastes: Solutions, Treatments and Opportunities - Selected Papers from the 3rd Edition of the International Conference on Wastes: Solutions, Treatments and Opportunities, 2015
140
TITLE: MODELING THE REFLOW SOLDERING PROCESS IN PCB'S
AUTHORS: Costa, J; Soares, D; S F C F Teixeira ; Cerqueira, F; Macedo, F; Rodrigues, N ; Ribas, L; Teixeira, JC;
PUBLISHED: 2015, SOURCE: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) in INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2, VOLUME: 2
AUTHORS: Costa, J; Soares, D; S F C F Teixeira ; Cerqueira, F; Macedo, F; Rodrigues, N ; Ribas, L; Teixeira, JC;
PUBLISHED: 2015, SOURCE: ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) in INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 2, VOLUME: 2