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TITLE: On the Fused Deposition Modelling of Personalised Bio-Scaffolds: Materials, Design, and Manufacturing Aspects
AUTHORS: Sousa, Helena Cardoso; Ruben, Rui B.; Viana, Julio C.;
PUBLISHED: 2024, SOURCE: BIOENGINEERING-BASEL, VOLUME: 11, ISSUE: 8
INDEXED IN: Scopus WOS CrossRef
3
TITLE: Optical bonding process of flat panel displays and their critical-to-quality factors
AUTHORS: Oliveira, Rui; Viana, Julio; Sampaio, Paulo;
PUBLISHED: 2023, SOURCE: INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, VOLUME: 125, ISSUE: 11-12
INDEXED IN: Scopus WOS CrossRef: 1
IN MY: ORCID
4
TITLE: Influence of adhesive on optical fiber-based strain measurements on printed circuit boards
AUTHORS: Freitas, C.; Leite, T. M.; Lopes, H.; Gomes, M.; Cruz, S.; Magalhaes, R.; Silva, A. F.; Viana, J. C.; Delgado, I.;
PUBLISHED: 2023, SOURCE: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, VOLUME: 34, ISSUE: 8
INDEXED IN: Scopus WOS CrossRef: 3
IN MY: ORCID
5
TITLE: Materials screening and characterization for functional printed automotive interiors parts
AUTHORS: Hammes, Nathalia; Ribeiro, Catarina; Machado, Catarina; Ferreira, Joao; Campos, Ricardo; Faye, Djibril; Cortez, Ana; Melo, Sandra; Duarte, Fernando; Pontes, Antonio; Viana, Julio C.; Pedrosa, Paulo; Homem, Natalia;
PUBLISHED: 2023, SOURCE: FLEXIBLE AND PRINTED ELECTRONICS, VOLUME: 8, ISSUE: 2
INDEXED IN: Scopus WOS CrossRef
IN MY: ORCID
6
TITLE: New Operational Load Monitoring Approach Using Digital Image Correlation and Image Classification Networks
AUTHORS: Mucha, W.; Kokot, G.; Viana, J. C.; Nunes, J. P.;
PUBLISHED: 2023, SOURCE: 6th International Conference on Aeronautical, Aerospace and Mechanical Engineering (AAME) in 6TH INTERNATIONAL CONFERENCE ON AERONAUTICAL, AEROSPACE AND MECHANICAL ENGINEERING, AAME 2023, VOLUME: 2512, ISSUE: 1
INDEXED IN: Scopus WOS CrossRef: 1
IN MY: ORCID
7
TITLE: A numerical methodology to support the development of liquid adhesive spreading patterns on display bonding process  Full Text
AUTHORS: Bastos, Lourenco; Duarte, Fernando M.; Viana, Julio C.; Silva, Filipe; Nogueira, Miguel; Carneiro, Filipa;
PUBLISHED: 2023, SOURCE: DISPLAYS, VOLUME: 79
INDEXED IN: Scopus WOS CrossRef
IN MY: ORCID
8
TITLE: Decoupling of Temperature and Strain Effects on Optical Fiber-Based Measurements of Thermomechanical Loaded Printed Circuit Board Assemblies
AUTHORS: Leite, Tiago Mauricio; Freitas, Claudia; Magalhaes, Roberto; da Silva, Alexandre Ferreira; Alves, Jose R.; Viana, Julio C.; Delgado, Isabel;
PUBLISHED: 2023, SOURCE: SENSORS, VOLUME: 23, ISSUE: 20
INDEXED IN: Scopus WOS CrossRef: 1
IN MY: ORCID
9
TITLE: Temperature Calibration for Distributed Temperature Sensing of Printed Circuit Boards Using Optical Fiber Sensors
AUTHORS: Leite, Tiago Mauricio; Freitas, Claudia; Magalhaes, Roberto; da Silva, Alexandre Ferreira; Alves, Jose Ricardo; Viana, Julio C.; Delgado, Isabel;
PUBLISHED: 2023, SOURCE: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, VOLUME: 13, ISSUE: 9
INDEXED IN: Scopus WOS CrossRef: 1
IN MY: ORCID
10
TITLE: Integrative simulation chain for improved components design: linking mould filling and structural simulations
AUTHORS: Barbosa, CN; Viana, JC; Franzen, M; Baranowski, T; Simoes, R;
PUBLISHED: 2022, SOURCE: POLYMER BULLETIN, VOLUME: 79, ISSUE: 8
INDEXED IN: Scopus WOS CrossRef
IN MY: ORCID
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