11
TITLE: Integrative simulation chain for improved components design: linking mould filling and structural simulations
AUTHORS: Barbosa, CN; Viana, JC; Franzen, M; Baranowski, T; Simoes, R;
PUBLISHED: 2022, SOURCE: POLYMER BULLETIN, VOLUME: 79, ISSUE: 8
INDEXED IN: Scopus WOS CrossRef
IN MY: ORCID
12
TITLE: A review on in-mold electronics technology  Full Text
AUTHORS: Mariana Beltrão; Fernando M Duarte; Júlio C Viana; Vitor Paulo;
PUBLISHED: 2022, SOURCE: Polymer Engineering and Science
INDEXED IN: Scopus
IN MY: ORCID
13
TITLE: A review on in-mold electronics technology  Full Text
AUTHORS: Beltrao, M; Duarte, FM; Viana, JC; Paulo, V;
PUBLISHED: 2022, SOURCE: POLYMER ENGINEERING AND SCIENCE
INDEXED IN: WOS
14
TITLE: Acute ST-elevation myocardial infarction: are men and women particular cases of STEMI ?
AUTHORS: Duarte, F.; Coutinho, I; Barradas, M., I; Oliveira, L.; Serena, C.; Fontes, A.; Monteiro, A.; Machado, C.; Santos, E.; Pelicano, N.; Pacheco, M.; Tavares, A.; Martins, D.;
PUBLISHED: 2022, SOURCE: EUROPEAN JOURNAL OF CARDIOVASCULAR NURSING, VOLUME: 21, ISSUE: SUPP_1
INDEXED IN: WOS
15
TITLE: Carbon nanotubes based multi-directional strain sensor
AUTHORS: Santos, A.; Amorim, L.; Nunes, J. P.; Silva, A. F.; Viana, J. C.;
PUBLISHED: 2022, SOURCE: MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, VOLUME: 285
INDEXED IN: Scopus WOS CrossRef: 6
IN MY: ORCID
16
TITLE: The role of printed electronics and related technologies in the development of smart connected products
AUTHORS: Buga, C. S.; Viana, J. C.;
PUBLISHED: 2022, SOURCE: FLEXIBLE AND PRINTED ELECTRONICS, VOLUME: 7, ISSUE: 4
INDEXED IN: Scopus WOS CrossRef: 22
IN MY: ORCID
17
TITLE: Investigation of Fracture Mechanisms of Self-Reinforced Polypropylene/Polycarbonate Composites Subjected to Fatigue Loading
AUTHORS: Katunin, A; Bilewicz, M; Wachla, D; Amraei, J; Viana, JCM;
PUBLISHED: 2022, SOURCE: Materials Science Forum, VOLUME: 1075
INDEXED IN: Scopus CrossRef: 1
IN MY: ORCID
18
TITLE: Optimisation of the green synthesis of Cu/Cu2O particles for maximum yield production and reduced oxidation for electronic applications
AUTHORS: Sampaio, S; Viana, JC;
PUBLISHED: 2021, SOURCE: MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, VOLUME: 263
INDEXED IN: Scopus WOS CrossRef: 8
IN MY: ORCID
19
TITLE: Thermoelectric response of a screen printed silver-nickel thermocouple
AUTHORS: Cruz, S; Azevedo, G; Cano Raya, C; Manninen, N; Viana, JC;
PUBLISHED: 2021, SOURCE: MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS, VOLUME: 264
INDEXED IN: Scopus WOS CrossRef: 8
IN MY: ORCID
20
TITLE: Bioinspired approaches for toughening of fi bre reinforced polymer composites
AUTHORS: Amorim, L; Santos, A; Nunes, JP; Viana, JC;
PUBLISHED: 2021, SOURCE: MATERIALS & DESIGN, VOLUME: 199
INDEXED IN: Scopus WOS CrossRef: 30
IN MY: ORCID
Page 2 of 11. Total results: 101.