Wafer-Level Integration of On-Chip Antennas and Re Passives Using High-Resistivity Polysilicon Substrate Technology

AuthID
 P-007-C2X
6
Author(s)
Sinaga, S
·
Polyakov, A
·
Bartek, M
·
Burghartz, JN
·
Document Type
Proceedings Paper
Year published
2004
Published
in 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS in Electronic Components and Technology Conference, ISSN: 0569-5503
Volume: 2, Pages: 1879-1884 (6)
Conference
54Th Electronic Components and Technology Conference, Date: FEB 03, 2004, Location: Las Vegas, NV, Sponsors: Elect Components Assembilies & Mat Assoc, Elect Ind Alliance, IEEE Comp Packaging & Mfg Technol Soc
Indexing
Wos®
Scopus®
Publication Identifiers
SCOPUS: 2-s2.0-10444283439
Wos: WOS:000224340900298
Source Identifiers
ISSN: 0569-5503
Export Publication Metadata
Marked List
 Add to Marked List
Info
At this moment we don't have any links to full text documens.

A place for researchers and their institutions

Useful Links

Get Help

© 2024 CRACS & Inesc TEC - All Rights Reserved Privacy Policy | Terms of Service