Effect of Source to the Substrate Distance on Thermoelectric Properties of Copper Nitride Thin Films Grown by Thermal Evaporation Method

AuthID
P-00Y-HW0
13
Author(s)
Basha, B
·
Jacob, J
·
Tanveer, Z
·
Ali, A
·
Amin, N
·
Javaid, K
·
Mahmood, K
·
Al Buriahi, MS
·
Alrowaili, ZA
·
Wang, HC
·
Sun, YQ
Tipo de Documento
Article
Year published
2023
Publicado
in JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, ISSN: 2238-7854
Volume: 25, Páginas: 265-272 (8)
Indexing
Publication Identifiers
SCOPUS: 2-s2.0-85161019149
Wos: WOS:001054626900001
Source Identifiers
ISSN: 2238-7854
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