Mode I Fatigue and Fracture Assessment of Polyimide-Epoxy and Silicon-Epoxy Interfaces in Chip-Package Components

AuthID
 P-010-2CQ
6
Author(s)
Morais, P
·
Akhavan-Safar, A
·
Marques, EAS
·
Karunamurthy, B
·
Tipo de Documento
Article
Year published
2024
Publicado
in POLYMERS, ISSN: 2073-4360
Volume: 16, Número: 4, Páginas: 463 (15)
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Wos®
Scopus®
Crossref®1
Pubmed®
Google Scholar®
Publication Identifiers
Pubmed: 38399841
SCOPUS: 2-s2.0-85185717649
Wos: WOS:001172376200001
Source Identifiers
ISSN: 2073-4360
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