Effect of Bath Temperature on Electroplating of Nickel on a Copper Substrate

AuthID
 P-010-ZT5
5
Author(s)
Sherwin, C
·
Goudar, DM
·
Haider, J
·
Raju, K
Tipo de Documento
Article in Press
Year published
2024
Publicado
in TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, ISSN: 0020-2967
Volume: 102, Número: 4, Páginas: 190-198 (9)
Indexing
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Scopus®
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Google Scholar®
Publication Identifiers
SCOPUS: 2-s2.0-85197674961
Wos: WOS:001264684200001
Source Identifiers
ISSN: 0020-2967
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