Challenges in Evaluating Thickness, Phase, and Strain in Semiconductor Devices Using High-Resolution Transmission Electron Microscopy

AuthID
 P-014-YYX
4
Author(s)
Conner, J
·
Murphy, S
·
Subramanian, S
Tipo de Documento
Proceedings Paper
Year published
2006
Publicado
in ISTFA 2006
Páginas: 343-350 (8)
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Wos®
Publication Identifiers
Wos: WOS:000282447800069
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